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收起 展开制造商 :
IntersilNXP SemiconductorsAnalog Devices IncFairchild SemiconductorSTMicroelectronicsMaxim IntegratedVishay SiliconixAlpha & Omega Semiconductor Inc
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封装/外壳 :
*
10-QFN
10-TFSOP,10-MSOP(0.118",3.00mm 宽)
10-UFBGA,WLCSP
10-UFQFN
10-VFDFN 裸露焊盘
10-WFDFN
12-UFBGA,FCBGA
16-QFN
16-VFQFN 裸露焊盘
6-TSSOP(5 引线),SC-88A,SOT-353
6-TSSOP,SC-88,SOT-363
6-XDFN
6-XFDFN
8-UFBGA,FCBGA
8-UFQFN
8-XFDFN
8-XFQFN 裸露焊盘
SC-74A,SOT-753
SOT-23-6
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供应商器件封装 :
10-DFN(3x3)
10-MicroPak™
10-MSOP
10-QFN (1.6x2.1)
10-QFN(1.8x1.4)
10-TDFN/MLP(3x3)
10-uDFN(2x2)
10-UMLP (1.8x1.4)
10-UTQFN (1.8x1.4)
10-UTQFN(1.4x1.8)
10-WLCSP(2.0x1.5)
10-迷你型QFN(1.4x1.8)
12-覆晶
16-QFN-EP(2.6x1.8)
16-QFN-EP(3x3)
6-TSSOP
6-XSON,SOT886(1.45x1)
8-XQFN(1.6x1.6)
8-XSON,SOT833-1 (1.95x1)
8-XSON,SOT996-2 (2x3)
8-覆晶
8-迷你型QFN(1.4x1.4)
SC-70-6
SOT-23-5
SOT-353
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